其他试验---国外基于数学图像相关法的各个学科研究情况

Assessing the Feasibility of Monitoring Strain in Historical Tapestries Using Digital Image Correlation

D. Khennouf*, J. M. Dulieu-Barton*, A. R. Chambers*, F. J. Lennard†

and D. D. Eastop†

*School of Engineering Sciences, University of Southampton, Highfield Southampton, SO17 1BJ, UK

†Textile Conservation Centre, University of Southampton, Park Avenue, Winchester, SO23 8DL, UK

Sheet-Metal Assessment at Medium Strain-Rates by Digital Image Correlation

G. B. Broggiato*, D. Ferrari*, M. Fischer† and V. Veglianti*

*University of Rome ‘‘La Sapienza’’ Mechanics and Aeronautics Department, Via Eudossiana, 18 – 00184 Rome, Italy

†Technische Universita¨t Braunschweig, IPROM, Institut fu¨r Produktionsmeßtechnik, Schleinitzstraße 20 – D-38106 Braunschweig,

Germany

[1] 2010 Blackwell Publishing Ltd j Strain (2010) doi: 10.1111/j.1475-1305.2009.00668.x

Effect of glue on reliability of flip chip BGA packages under thermal cycling

Tung T. Nguyen, Donggun Lee, Jae B. Kwak, Seungbae Park *

Department of Mechanical Engineering, State University of New York at Binghamton, NY 13902, United States

Article history:

Received 25 August 2009

Received in revised form 7 April 2010

Available online 28 April 2010