高温实验---国外基于数学图像相关法的各个学科研究情况

HIGH RESOLUTION CHARACTERIZATION OF MATERIALS USED IN PACKAGES THROUGH DIGITAL IMAGE CORRELATION

V. Srinivasan1, S. Radhakrishnan1, X. Zhang1, G. Subbarayan1, T. Baughn2, L. Nguyen3

1Purdue University, West Lafayette, IN 47907

2Raytheon Systems Corporation, Dallas, TX 75243

3National Semiconductor Corporation, Santa Clara, CA 95052